The purpose of the TAPPI Scholarship Program is to recognize academic excellence, increase awareness and participation in TAPPI’s member groups and to attract talented individuals to the industry segments that TAPPI serves.
The Joe Dieffenbacher Engineering Memorial Scholarship fund ($5,000) has been established by the Corrugated Packaging Council of TAPPI to be awarded to a student interested in entering the engineering area of the corrugated industry.
Special Requirements:
- No specific grade point average is required
- Working full time or part time in the corrugated industry and attending day/night school for a graduate or undergraduate degree OR be a full time student in a two-year or a four-year college, university or technical school.
- Demonstrate an interest in the corrugated packaging industry related to maintenance or engineering (part time employment or internships in the corrugated industry are looked upon in a very favorable manner).
- Selection of the scholarship winners will be based on the scholarship committee’s opinion of overall maturity, job potential and the candidates’ future contribution potential to the corrugated industry.
Historical Background of the Scholarship
The corrugated industry was saddened by the passing of Joseph Andrew Dieffenbacher, 60, of Olive Branch, MS, on August 7, 2018 after a courageous 2-year battle with Merkel Cell Carcinoma. The Corrugated Packaging Council of TAPPI has established this memorial scholarship fund in his honor
Born on March 18th to John and Jeanette Dieffenbacher of Whippany NJ, Joe started his career with International Paper at age 16, as a Draftsman in the Whippany, NJ headquarters.
Joe earned an AS Degree in Mechanical Engineering from both County College of Morris, NJ and Memphis State University. Over time, Joe held positions of increasing responsibility including Plant Engineer, Regional Engineer, Chief Engineer and ultimately Manager, Engineering & Capital Purchasing – North America Container, with engineering oversight of over 170 locations in the U.S., Mexico and Chile.
Joe could accomplish anything he set his mind to and was truly a self-made man. He was instrumental in the design & development of several technological advances in the corrugated industry and contributed in the development of multiple patents held by IP. Joe served as a member of the Corrugated Packaging Council in TAPPI, the Technical Association of the Pulp and Paper Industry. Along the way, he mentored many colleagues in their career paths, and became the principal technical resource for what eventually became the world’s largest supplier of corrugated packaging.
Joe passed just prior to his 44th anniversary with IP. His career took him around the world. His dedication to his job was unsurpassed, and he was truly respected by everyone throughout the industry. His sharp-wit and generous spirit were admirable.
Corrugated - Joe Dieffenbacher Engineering Memorial Scholarship
The purpose of the TAPPI Scholarship Program is to recognize academic excellence, increase awareness and participation in TAPPI’s member groups and to attract talented individuals to the industry segments that TAPPI serves.
The Joe Dieffenbacher Engineering Memorial Scholarship fund ($5,000) has been established by the Corrugated Packaging Council of TAPPI to be awarded to a student interested in entering the engineering area of the corrugated industry.
Special Requirements:
- No specific grade point average is required
- Working full time or part time in the corrugated industry and attending day/night school for a graduate or undergraduate degree OR be a full time student in a two-year or a four-year college, university or technical school.
- Demonstrate an interest in the corrugated packaging industry related to maintenance or engineering (part time employment or internships in the corrugated industry are looked upon in a very favorable manner).
- Selection of the scholarship winners will be based on the scholarship committee’s opinion of overall maturity, job potential and the candidates’ future contribution potential to the corrugated industry.
Historical Background of the Scholarship
The corrugated industry was saddened by the passing of Joseph Andrew Dieffenbacher, 60, of Olive Branch, MS, on August 7, 2018 after a courageous 2-year battle with Merkel Cell Carcinoma. The Corrugated Packaging Council of TAPPI has established this memorial scholarship fund in his honor
Born on March 18th to John and Jeanette Dieffenbacher of Whippany NJ, Joe started his career with International Paper at age 16, as a Draftsman in the Whippany, NJ headquarters.
Joe earned an AS Degree in Mechanical Engineering from both County College of Morris, NJ and Memphis State University. Over time, Joe held positions of increasing responsibility including Plant Engineer, Regional Engineer, Chief Engineer and ultimately Manager, Engineering & Capital Purchasing – North America Container, with engineering oversight of over 170 locations in the U.S., Mexico and Chile.
Joe could accomplish anything he set his mind to and was truly a self-made man. He was instrumental in the design & development of several technological advances in the corrugated industry and contributed in the development of multiple patents held by IP. Joe served as a member of the Corrugated Packaging Council in TAPPI, the Technical Association of the Pulp and Paper Industry. Along the way, he mentored many colleagues in their career paths, and became the principal technical resource for what eventually became the world’s largest supplier of corrugated packaging.
Joe passed just prior to his 44th anniversary with IP. His career took him around the world. His dedication to his job was unsurpassed, and he was truly respected by everyone throughout the industry. His sharp-wit and generous spirit were admirable.