International Flexible Packaging and Extrusions - The Daniel Siegel Memorial Scholarship
The Daniel Siegel Memorial Scholarship Fund
Purpose: To encourage talented science and engineering students to pursue careers in the packaging industry, to develop awareness of the industry, and strengthen the TAPPI International Flexible Packaging and Extrusions (IFPED) Division.
The Daniel Siegel Memorial Scholarship is presented only in even-numbered years. The $4,000 scholarship will be awarded to a TAPPI Student Chapter member enrolled in a packaging or related major. Funded by an endowment from MICA Corporation and the Siegel family. Industries pertaining to these technologies include packaging, industrial films and laminations, blown and cast films extrusion, extrusion coatings and laminations, sheet extrusion, and printing associated with these areas.
Special requirements: Applicants must demonstrate an interest in the technological areas covered by the International Flexible Packaging and Extrusions Division.
The purpose of the TAPPI Scholarship Program is to recognize academic excellence, increase awareness and participation in TAPPI’s member groups, and to attract talented individuals to the industry segments that TAPPI serves. If you are pursuing an education in the paper and related industries, then TAPPI has many scholarships for which you can qualify. Each scholarship can help to open a window of opportunity for you to achieve your personal, educational and professional goals.
TAPPI is the world’s largest association for the paper and related industries that
- Collects and disseminates technical information and technology updates
- Promotes professional growth and competence in the workplace
- Enables employers to address issues of industry concern collectively and cooperatively We encourage you to take advantage of the TAPPI scholarships and to apply for all of those for which you may qualify. And we wish you well as you pursue your goals within the increasingly important and challenging fields of today’s paper and related industries.
Deadline: February 15
The deadline for completed scholarship applications to be received at TAPPI for Technical Division Scholarships is February 15 for the academic year beginning the following fall.
What happens next?
To qualify for the scholarship, complete the application on Survey Monkey Apply by February 15. Following the closing date, a designated committee reviews all submissions to select the top candidates that complete the special requirements. When winners are selected, all applicants will be notified. You can check back on your status at any time by logging into Survey Monkey Apply.
If you are not chosen this year, please visit back next year to reapply improving your application where you see fit!
For support or additional question contact: firstname.lastname@example.org